Staff Package Design Engineer - Experienced In Package Development Of Power SiP/Module

The Staff Package Design Engineer will design and develop packaging solutions for power SiP/modules, wafer level, flip-chip, and multi-chip modules, collaborating with OSATs, contract manufacturers, and internal teams to qualify materials, processes, and ensure quality. The role involves technical expertise, process optimization, and supporting production ramp-up for automotive, industrial, and consumer power applications.