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taiwansemiP1
This role supports TSMC’s leadership in 3DIC and advanced packaging by extending expertise beyond chip-level design into package-level integration. The position involves designing, simulating, and modeling complex substrate and packaging technologies to address challenges such as warpage, power delivery, and thermal management. The engineer will collaborate with cross-functional teams to define future customer requirements and shape the direction of 3DIC development.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for taiwansemiP1.
49% above the average for this role
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