Technology development engineer – AIT (Assembly Interconnection Technology)
Bosch Group
About this role
A Electronics Packaging Engineer at Bengaluru with 3-5 years of experience in assembly and interconnect technology development, focusing on processes like sealing, thermal management, and electronics protection. The role involves process development, validation, cross-functional collaboration, and risk analysis.
Skills
Qualifications
About Bosch Group
bosch.comBosch is a global engineering and technology company that designs and manufactures hardware, software, and services across mobility solutions, industrial technology, consumer goods (power tools and appliances), and energy & building technology. Guided by the motto "Invented for life," it concentrates on R&D-driven innovation in areas such as automotive components and ADAS, electrification, IoT and connected devices, smart home systems, and industrial automation. Bosch serves consumers, businesses and public-sector customers worldwide with an emphasis on quality, sustainability and digitalization to improve safety, efficiency and comfort.
About Bosch Group
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Bosch Group.
Salary
$85k – $110k
per year
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