MTS Process Integration Engineer | APTD Die Level Technology

The Process Integration Engineer for Advanced Packaging plays a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. This position involves designing experiments, analyzing yield and performance data, and driving technology transfer to support the transition of emerging technologies into manufacturing. The role requires collaboration across engineering disciplines to improve performance, optimize processes, and solve complex technical challenges for next-generation packaging solutions.