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Advanced Package Technology Engineer at Broadcom - ApplyBlast

Advanced Package Technology Engineer

Broadcom

1 day ago

3.3 on Glassdoor

Fort Collins, Colorado, United States

Onsite

Full Time

Senior

0 applicants

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About this role

As a key member of the Worldwide ASIC Product Development team, this role leads the development of cost-effective, high-performance advanced custom packaging solutions, including 2.5D and 3D technologies. The position involves collaborating with internal technical teams, external partners, and customers to define requirements and drive unified solutions for future product demands. The engineer will oversee program management, support new product introductions, and ensure solutions meet stringent signal integrity, thermal, and reliability standards.

Responsibilities

Lead development of cost-effective advanced custom packaging solutions
Serve as subject matter expert in 2.5D and 3D advanced packaging technologies
Support new product introduction and high-volume manufacturing ramps

Skills

Qualifications

Ph.D. in Mechanical, Electrical, or Electronics EngineeringMaster's degree in Mechanical, Electrical, or Electronics Engineering

About Broadcom

broadcom.com

Headquarters

Palo Alto, California, United States

Company Size

10001+ employees

Founded

1991

View Profile

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.