Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

The Process Integration Lead for Advanced Packaging will lead a team in developing and integrating advanced packaging technologies, including 2.5D, 3D, and HBM solutions, from concept through full-scale manufacturing. This role drives technology development, process integration, and technology transfer while mentoring a technical team and shaping the roadmap for next-generation packaging platforms. The position involves collaborating with cross-functional teams to deliver high-performance multi-die solutions and scale proven methodologies across global organizations.