IC Package Design / Development
Broadcom(4 days ago)
About this role
This position is for an IC Packaging Engineer specializing in advanced silicon node packaging technology. The role involves designing, optimizing, and managing packaging solutions aligned with cutting-edge semiconductor processes, working closely with cross-functional teams and external suppliers.
Required Skills
- IC Packaging
- Substrate Design
- Signal Integrity
- Thermal Management
- High-Speed IO
- Cadence Allegro
- Bump Architecture
- Package Optimization
- High Volume Manufacturing
- Advanced Silicon Nodes
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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