Packaging Engineer
Cambridge GaN Devices
About this role
CGD, a fabless semiconductor company developing energy-efficient GaN-based power devices, is seeking a packaging engineer to support the technical development of high performance and high-density semiconductor packaging solutions. The role involves collaboration with multiple teams, market research, simulation, design, testing, and technical support within a dynamic and innovative environment.
Skills
About Cambridge GaN Devices
camgandevices.comCambridge GaN Devices provides Gallium Nitride transistors and GaN semiconductor solutions designed for high-performance, energy-efficient power electronics. Their GaN devices enable higher efficiency, faster switching, and smaller form factors across a range of applications. The company emphasizes technology-driven products and resources to support developers and engineers in designing next-generation power systems. Overall, Cambridge GaN Devices focuses on delivering energy savings and advanced performance through GaN-based power components.
Recent company news
Cambridge GaN Devices appoints Fabio Necco as new CEO
Jan 6, 2026
Cambridge GaN Devices partners with GlobalFoundries
Oct 14, 2025
Cambridge GaN Devices secures $32m to advance power technology
1 month ago
CGD partners with GlobalFoundries to supply single chip, reliable and efficient ICeGaN power devices
Oct 15, 2025
CGD appoints new CEO
Jan 6, 2026
About Cambridge GaN Devices
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for Cambridge GaN Devices.
Salary
$60k – $90k
per year
More jobs at Cambridge GaN Devices
Similar Jobs
Semiconductor Packaging Mechanical Engineer
Intel
High-Power Packaging Engineer
Monolithic Power Systems
Semiconductor Packaging Mechanical Engineer
Intel
Intern, IC Packaging Thermal Analysis (Summer 2026)
SK hynix America
Principal Thermal Simulation Engineer, APTD
Eightfold
Thermal Mechanical Modeling Engineer
The University of Texas at Austin