Packaging Module Development Engineer
Intel(21 days ago)
About this role
Microelectronic Packaging Engineer at Intel Foundry focused on applying machine vision and machine learning to semiconductor packaging manufacturing. The role supports package definition, development and technology certification for integrated circuit assemblies while interfacing with vendors and cross-functional teams. This is an on-site, college-graduate level position based in Phoenix, AZ.
Required Skills
- Machine Vision
- Machine Learning
- Package Design
- Thermal Design
- Mechanical Design
- Electrical Design
- Optics
- Imaging
- Python
- OpenCV
+5 more
Qualifications
- BS in Engineering, Physics, or Computer Science
- MS in Engineering, Physics, or Computer Science
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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