Packaging Module Development Engineer
Intel(1 day ago)
About this role
The Packaging Module Development Engineer at Intel focuses on designing and developing innovative packaging solutions for advanced semiconductor products. They work with cross-disciplinary teams to enhance the reliability, performance, and manufacturability of packaging technologies, contributing to Intel's industry leadership.
Required Skills
- Mechanical Design
- Reliability Modeling
- Finite Element Analysis
- Packaging Mechanics
- Surface Mount Techniques
- Tolerancing
- Product Development
- Engineering Collaboration
- Packaging Solutions
- Manufacturing
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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