Principal Package R&D Engineer
Nexperia(1 day ago)
About this role
Nexperia is seeking a Package Architect to join its European R&D team, responsible for the functionality and performance of semiconductor products. The role involves leadership in technical projects, collaboration across a multicultural global team, and providing technical support and innovation within semiconductor packaging.
Required Skills
- SEMICONDUCTOR
- Packaging
- Simulation
- Thermo Mechanical
- Materials Technology
- Mechanical Engineering
- Critical Judgement
- Problem Solving
- Communication
- Teamwork
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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