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Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) at SpaceX - ApplyBlast

Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)

SpaceX

6 hours ago

3.7 on Glassdoor

Bastrop, Texas, United States

Onsite

Full Time

Medior

0 applicants

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About this role

SpaceX is seeking a hands-on Process Engineer to develop, optimize, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. The role involves taking processes from early prototype through production ramp, working directly with equipment and cross-functional partners including package engineering, design, manufacturing, reliability, materials, and supply-chain teams. The engineer will drive NPI from prototype through qualification and production release, performing root-cause analysis and supporting failure analysis.

Responsibilities

Develop and qualify gold-to-gold interconnect and thermosonic flip-chip bonding processes
Optimize vacuum mold lamination and encapsulation processes to troubleshoot defects
Drive new product introduction from prototype through production release and qualification

Skills

About SpaceX

spacex.com

Headquarters

Hawthorne, California, United States

Company Size

1001-5000 employees

Founded

2002

View Profile

SpaceX is an aerospace manufacturer and launch services company that designs, manufactures, and launches advanced rockets and spacecraft. Founded in 2002 to revolutionize space technology and ultimately enable human life on other planets, it developed the Falcon 9 and Falcon Heavy rockets, the Dragon crew/cargo spacecraft, and the next‑generation Starship — with a strong emphasis on reusable boosters. SpaceX provides commercial and government launch services (including crewed ISS missions, satellite deployments and rideshares) and operates the Starlink broadband constellation. The company is known for rapid iterative development and cost‑reduction through reuse to expand access to space.