Teledyne Aerospace & Defense Electronics
A Senior Packaging Engineer at Teledyne HiRel Electronics focuses on advancing integrated circuit packaging technologies for aerospace and defense markets. The position supports high-reliability product development and is based on-site in Milpitas, CA or Garland, TX.
Headquarters
Rancho Cordova, California, United States
Company Size
1001-5000 employees
Teledyne Aerospace & Defense Electronics specializes in providing high-reliability solutions for the defense, space, and commercial markets, particularly in demanding environments. The company offers a range of innovative products including avionics systems, radar systems, satellite modems, and secure communication solutions. With a focus on cutting-edge technology and engineering excellence, Teledyne aims to meet the complex needs of military and commercial applications in aerospace and defense sectors.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Teledyne Aerospace & Defense Electronics.
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