Silicon Packaging Design Engineer

Intel(1 month ago)

United States, Arizona, Phoenix, AZOnsiteFull TimeJunior$91,150 - $172,860Foundry Technology Manufacturing

About this role

The Silicon Packaging Design Engineer is an entry-level engineering role within Intel's Foundry Services organization, part of the IDM2.0 initiative to expand US and European foundry capacity. The role supports development of packaging and substrate solutions that enable customer silicon to become production-ready. The position is based in Phoenix, AZ and reports into the Foundry Technology Manufacturing business group.

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Required Skills

Substrate Design
Physical Layout
Routing
DRC Analysis
Package Layout
Signal Integrity
Power Delivery
Scripting
Cadence APD
Xpedition

Qualifications

Bachelor's in Mechanical Engineering
Bachelor's in Electrical Engineering
Master's in Mechanical Engineering
Master's in Electrical Engineering

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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