Technical Director – Advanced Packaging

Applied Materials(3 months ago)

Hsinchu, TaiwanOnsiteFull TimeDirector$229,830 - $305,261 (estimated)Research & Development

About this role

Applied Materials is hiring a (Sr.) Technical Director within its Advanced Packaging Technology team in Hsinchu, Taiwan to lead next-generation semiconductor packaging R&D. The position serves as the key technical interface with TSMC’s Advanced Packaging organization across development and high-volume manufacturing sites, with high visibility and direct engagement with senior leadership. The role focuses on shaping advanced packaging technology direction and customer-facing technical partnership within a fast-growing division.

View Original Listing

Required Skills

Advanced Packaging
Semiconductor R&D
Technology Roadmapping
Customer Engagement
New Product Introduction
Technical Leadership
Project Management
Process Optimization
Yield Improvement
Process Integration

+5 more

Qualifications

MS in Materials Science
PhD in Materials Science
MS in Chemical Engineering
PhD in Chemical Engineering
MS in Electrical Engineering
PhD in Electrical Engineering

About Applied Materials

appliedmaterials.com

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.

View more jobs at Applied Materials →