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Expert IC Package Design Lead at Astera Labs - ApplyBlast

Expert IC Package Design Lead

Astera Labs

7 months ago

4.3 on Glassdoor

Israel

Onsite

Full Time

Senior

0 applicants

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About this role

Astera Labs is establishing a new R&D center in Israel to develop advanced semiconductor chips for AI and data infrastructure. The company is looking for a senior technical leader to oversee the design and implementation of IC packaging solutions, supporting their growth in AI and cloud computing technologies.

Skills

Qualifications

10+ years of IC packaging experienceProficiency in IC package design toolsExperience with complex packages such as BGA, FCBGA, FCCSPDeep understanding of signal, power, and thermal integrityManufacturing and release experience

About Astera Labs

asteralabs.com

Headquarters

Santa Clara, California, United States

Company Size

201-500 employees

Founded

2017

View Profile

Astera Labs is a semiconductor company that builds purpose‑built connectivity silicon and system solutions for rack‑scale AI and modern data centers. They design high‑speed retimers, PHY/connectivity devices, interposers and companion firmware/software that extend signal reach, improve link reliability, and enable PCIe/CXL and other accelerator interconnects across cables and backplanes. Astera’s products add telemetry, error monitoring and management features to simplify integration for OEMs, cloud providers and hyperscalers. The company focuses on enabling scalable, low‑latency multi‑node AI training and inference systems.