Expert IC Package Design Lead

Astera Labs(1 day ago)

IsraelOnsiteFull TimeSenior$160,000 - $200,000Research and Development

About this role

Astera Labs is establishing a new R&D center in Israel to develop advanced semiconductor chips for AI and data infrastructure. The company is looking for a senior technical leader to oversee the design and implementation of IC packaging solutions, supporting their growth in AI and cloud computing technologies.

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Required Skills

ICDesign
PackageDesign
SignalIntegrity
ThermalManagement
Manufacturing
Semiconductor
ICPackaging
EDA Tools
HighSpeedInterfaces
SystemIntegration

Qualifications

10+ years of IC packaging experience
Proficiency in IC package design tools
Experience with complex packages such as BGA, FCBGA, FCCSP
Deep understanding of signal, power, and thermal integrity
Manufacturing and release experience

About Astera Labs

asteralabs.com

Astera Labs is a semiconductor company that builds purpose‑built connectivity silicon and system solutions for rack‑scale AI and modern data centers. They design high‑speed retimers, PHY/connectivity devices, interposers and companion firmware/software that extend signal reach, improve link reliability, and enable PCIe/CXL and other accelerator interconnects across cables and backplanes. Astera’s products add telemetry, error monitoring and management features to simplify integration for OEMs, cloud providers and hyperscalers. The company focuses on enabling scalable, low‑latency multi‑node AI training and inference systems.

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