SMTS ULP CMOS Advanced Packaging TSV Integrator

GlobalFoundries(8 months ago)

SingaporeOnsiteFull TimeSenior$160,178 - $215,604 (estimated)Engineering

About this role

GlobalFoundries is hiring a Development Integration Engineer to join the ULP CMOS product team’s Advanced Packaging group in Singapore. The role focuses on enabling new advanced packaging features and offerings on FINFET and FDSOI base technologies, supporting efforts from early process demonstration through manufacturing transfer. The position is part of a global semiconductor foundry environment supporting cutting-edge packaging capabilities such as through-silicon via applications.

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Required Skills

Advanced Packaging
Process Integration
Process Development
Process Flows
Process Recipes
Process Control
Inspection
Root Cause Analysis
DOE
Data Analysis

+8 more

Qualifications

BS in Electrical Engineering
BS in Materials Science
MS in Related Field
PhD in Related Field

About GlobalFoundries

gf.com

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.

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