Application Engineer I: Package and Interposer Design
BETA CAE Greece(15 days ago)
About this role
Cadence Design Systems is seeking a full-time engineer to join their Silicon Package Board team focused on Advanced Packaging Design. The role involves working with state-of-the-art IC packaging technologies, supporting customer adoption, and developing technical solutions. The position offers opportunities for training, professional growth, and engagement in innovative electronic design projects.
Required Skills
- EDA
- Package Design
- PCB Design
- Scripting
- Signal Integrity
- Power Integrity
- Electromagnetics
- RF
- Python
- Perl
About BETA CAE Greece
beta-cae.comBETA CAE Systems is a leading provider of advanced simulation software solutions that cater to the needs of engineers and researchers in various fields, including automotive, aerospace, and manufacturing. With a comprehensive suite of tools for computer-aided engineering (CAE), BETA empowers users to effectively perform tasks related to finite element analysis (FEA), computational fluid dynamics (CFD), and process automation. Recently acquired by Cadence, the company continues to innovate in areas such as machine learning and predictive analysis, bolstering its commitment to enhancing product design and simulation accuracy.
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